SPRING 2006 Presentations

Decoupling High Speed Systems and Processors Andrew Ritter, Timothy Sullivan, AVX Corporation. Presented at IMAPS Fall 2007. View Presentation

Ceramic Thin Films For Embedded Capacitors Dr. Junghyun Cho, Binghamton University, NY. Presented at IMAPS Fall 2007. View Presentation

Polymer Ferroelectrics For Printed Non-Volatile Memory Mike Thompson, Cornell University, Ithaca, NY. Presented at IMAPS Fall 2007. View Presentation

cLGA Connector Roadmap Presentation D.Neidich, Amphenol Harrisburg PA. Presented at IMAPS Fall 2007. View Presentation

Avoiding Printed Circuit Board Disasters – Focusing On The Fundamentals Bruce Chamberlain, STSM, IBM Endicott, NY. Presented at IMAPS Fall 2007. View Presentation

CZT (cadmium zinc telluride) Packaging C. Woychik, GE Global Research, Niskayuna, NY. Presented at IMAPS Fall 2007. View Presentation

3D Packaging Challenges and Opportunities John Knickerbocker, IBM Research,Yorktown Heights,NY. Presented at IMAPS Fall 2007. View Presentation

Electronics Packaging For Extreme Environments Dr. Wayne Johnson, Auburn University. Presented at IMAPS Fall 2007. View Presentation